low k dielectric_low_dielectric

This paper introduces basic technology of copper interconnect, including single and dual damascene technology, CMP technology, low k dielectric materials, barrier materials and

ybrid Material for Transparent Low-k Dielectric

ybrid Material for Transparent Low-k Dielectric

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roperty Characterization of Low-k Dielectric Po

roperty Characterization of Low-k Dielectric Po

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Evaluation of ultra-low-k dielectric materials for

Evaluation of ultra-low-k dielectric materials for

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n studies of xerogel and SiLK low-K dielectric m

n studies of xerogel and SiLK low-K dielectric m

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icron replica molding of porous low-k dielectric

icron replica molding of porous low-k dielectric

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Characterization of Low-k Dielectric Etch Resid

Characterization of Low-k Dielectric Etch Resid

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nd property characterization of low-k dielectric p

nd property characterization of low-k dielectric p

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《Applying Zeolites as Low Dielectric Constan

《Applying Zeolites as Low Dielectric Constan

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Evaluation of ultra-low-k dielectric materials for

Evaluation of ultra-low-k dielectric materials for

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使用 Dielectric Material 明暗器--3DMAX 官方中

使用 Dielectric Material 明暗器--3DMAX 官方中

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High-k Materials with Low Dielectric Loss Base

High-k Materials with Low Dielectric Loss Base

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Low damage and anisotropic dry etching of hig

Low damage and anisotropic dry etching of hig

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Low-Dielectric Constant Materials II: Volume 44

Low-Dielectric Constant Materials II: Volume 44

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tic Study of Plasma Damage to Porous Low-K:

tic Study of Plasma Damage to Porous Low-K:

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Low-frequency dielectric properties of DMAAS

Low-frequency dielectric properties of DMAAS

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