This paper introduces basic technology of copper interconnect, including single and dual damascene technology, CMP technology, low k dielectric materials, barrier materials and

ybrid Material for Transparent Low-k Dielectric
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roperty Characterization of Low-k Dielectric Po
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Evaluation of ultra-low-k dielectric materials for
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n studies of xerogel and SiLK low-K dielectric m
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icron replica molding of porous low-k dielectric
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Characterization of Low-k Dielectric Etch Resid
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nd property characterization of low-k dielectric p
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《Applying Zeolites as Low Dielectric Constan
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Evaluation of ultra-low-k dielectric materials for
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使用 Dielectric Material 明暗器--3DMAX 官方中
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High-k Materials with Low Dielectric Loss Base
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Low damage and anisotropic dry etching of hig
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Low-Dielectric Constant Materials II: Volume 44
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tic Study of Plasma Damage to Porous Low-K:
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Low-frequency dielectric properties of DMAAS
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