通孔封装 multi chip【相关词_ multi chip】

多芯片组件(Multi-Chip Module即MCM)封装技术因组装密度高,改善了频率特性和传输速 Multi-vias is a kind of interconnection largely existing in the multi-chip module (MCM) pac

欧司朗Multi CHIPLED成就高品质裸眼3D LED

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bstrate-technology for VLSI package\/multichip

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bstrate-technology for VLSI package\/multichip

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欧司朗 Multi CHIPLED LED 再放异彩 - LED光

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Vicor 推出 7 款采用 ChiP 封装的全新 DCM

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驱动IC封装COF(Chip On Film) 基板生产厂家

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bstrate-technology for VLSI package\/multichip

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欧司朗Multi CHIPLED成就高品质裸眼3D显示屏

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70种IC封装术语之FP\/flip-chip\/FQFP\/CPAC\/C

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板上晶片封装chip on board(COB)

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RFID封装工艺:Flip Chip和wire bonding-中国LE

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【KF8F312 SOIC-20脚封装,代理CHIPON品牌

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C61F302 SOIC-20封装,CHIPON单片机全系列

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70种IC封装术语之FP\/flip-chip\/FQFP\/CPAC\/C

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Vishay推出采用ChipLED封装的小尺寸SMD L

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